| Microchip | 1Mbps | 1 | - | IEC 61000-4-2 | CAN收发器芯片 | 待机 | 70 mA | 通孔 | PDIP | 8 | 10.2 x 7.1 x 5mm | 10.2mm | 7.1mm | 5mm | 5.5 V | 4.5 V | +150 °C |
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| Microchip | 1Mbps | 1 | - | CAN 2.0B | CAN IO 扩展器 IC | 睡眠 | 20 mA | 通孔 | PDIP | 14 | 19.05 x 6.35 x 3.3mm | 19.05mm | 6.35mm | 3.3mm | 5.5 V | 2.7 V | +85 °C |
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| onsemi | - | 1 | - | CAN | CAN收发器芯片 | 关闭 | - | 贴片 | TSSOP-EP | 16 | 5.1 x 4.5 x 0.95mm | 5.1mm | 4.5mm | 0.95mm | 28 V | 5 V | +150 °C |
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| onsemi | 5Mbps | 1 | - | - | CAN收发器芯片 | - | 105 mA | 贴片 | SOIC | 8 | 4.9 x 3.9 x 1.5mm | 4.9mm | 3.9mm | 1.5mm | 5.25 V | 4.75 V | +150 °C |
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| Texas Instruments | 2Mbps | 1 | - | ISO 11898-2 | CAN收发器芯片 | 待机 | 2 mA | 贴片 | SOIC | 8 | 5 x 3.98 x 1.5mm | 5mm | 3.98mm | 1.5mm | 5.5 V | 4.5 V | +125 °C |
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| Texas Instruments | 1Mbps | 1 | - | ISO 11898-2 | CAN收发器芯片 | 正常 | 2 mA | 贴片 | SOIC | 8 | 3 x 1.75 x 1.3mm | 3mm | 1.75mm | 1.3mm | 3.6 V | 3 V | +125 °C |
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| Microchip | 20kBd | 2 | - | LIN 1.3,LIN 2.0,LIN 2.1,SAE J2602 | LIN收发器芯片 | 睡眠 | 1 mA | 通孔 | PDIP | 8 | 9.27 x 6.35 x 3.3mm | 9.27mm | 6.35mm | 3.3mm | 27 V | 6 V | +125 °C |
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| Microchip | 5Mbps | 1 | - | CAN 1.2,CAN 2.0A,CAN 2.0B | - | 睡眠,待机 | 10 mA | 贴片 | TSSOP | 20 | 6.5 x 4.4 x 0.9mm | 6.5mm | 4.4mm | 0.9mm | 5.5 V | 3 V | +85°C |
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| Microchip | 5Mbps | - | - | CAN 2.0B, CAN FD | - | 睡眠,待机 | 20 mA | - | - | - | - | - | - | - | - | - | - |
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| Texas Instruments | 500kBd | 1 | - | ISO/DIS | CAN收发器芯片 | - | 80 mA | 贴片 | SOIC | 8 | 5 x 4 x 1.5mm | 5mm | 4mm | 1.5mm | 5.5 V | 4.5 V | +70 °C |
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| Texas Instruments | 1Mbps | 1 | - | ISO 11898 | CAN收发器芯片 | 待机 | 6 mA | 贴片 | SOIC | 8 | 4.9 x 3.91 x 1.58mm | 4.9mm | 3.91mm | 1.58mm | 3.6 V | 3 V | +125 °C |
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| Microchip | 1Mbps | 1 | - | ISO 11898 | CAN收发器芯片 | 睡眠,待机 | 75 mA | 通孔 | PDIP | 8 | 10.2 x 7.1 x 5mm | 10.2mm | 7.1mm | 5mm | 5.5 V | 4.5 V | +85 °C |
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| Infineon | 5Mbps | - | - | CAN | - | 高速 | - | - | - | - | - | - | - | - | - | - | - |
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| Microchip | 20kBd | 1 | - | LIN 1.3,LIN 2.0,LIN 2.1,SAE J2602 | LIN收发器芯片 | 关闭 | 1 mA | 贴片 | SOIC | 8 | 4.9 x 3.9 x 1.25mm | 4.9mm | 3.9mm | 1.25mm | 18 V | 6 V | +125 °C |
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| Microchip | 20kBd | 1 | - | LIN 1.3,LIN 2.0,LIN 2.1,SAE J2602 | LIN收发器芯片 | 关闭 | 1 mA | 贴片 | SOIC | 8 | 4.9 x 3.9 x 1.25mm | 4.9mm | 3.9mm | 1.25mm | 18 V | 6 V | +125 °C |
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| onsemi | 20kbps | 1 | - | - | LIN收发器芯片 | 待机 | 6.5 mA | 贴片 | SOIC | 8 | 4.9 x 3.9 x 1.5mm | 4.9mm | 3.9mm | 1.5mm | 18 V | 5 V | +150 °C |
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| Microchip | 1Mbps | 1 | - | ISO 11898-2, ISO 11898-5 | CAN收发器芯片 | 正常,待机 | 70 mA | 贴片 | SOIC | 8 | 4.9 x 3.9 x 1.5mm | 4.9mm | 3.9mm | 1.5mm | 5.5 V | 4.5 V | +125 °C |
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| Microchip | 20kBd | 1 | - | SAE J2602 | LIN收发器芯片 | 睡眠 | 1 mA | 贴片 | SOIC | 8 | 4.9 x 3.9 x 1.5mm | 4.9mm | 3.9mm | 1.5mm | 18 V | 6 V | +125 °C |
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| Infineon | 5Mbit/s | 1 | - | ISO 11898-2 | CAN收发器芯片 | 高速 | 250 mA | - | PG-VQFN-48 | 48 | - | - | - | - | - | - | - |
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| Microchip | 2 Mbps, 5 Mbps, 8Mbps | 1 | - | ISO 11898-2, ISO 11898-5 | CAN收发器芯片 | 待机 | 70 mA | 通孔 | PDIP | 8 | 10.16 x 7.11 x 4.95mm | 10.16mm | 7.11mm | 4.95mm | 5.5 V | 4.5 V | +125 °C |