Kingston 16 Gbyte NAND闪存芯片, eMMC接口, BGA-153, 11.5 x 13 x 1.2mm

  • RS 库存编号 785-2338
  • 制造商零件编号 KE4CN4A5A
  • 制造商 Kingston
产品技术参数资料
法例与合规
符合
COO (Country of Origin): TW
产品详细信息

Flash eMMC,19mm - Kingston

Kingston’s 19nm Flash eMMC follows the JEDEC eMMC 4.5 standard interface. The embedded MMC controller directs the Flash management, including ECC, wear levelling, IOPS optimization and read sensing and reduces the storage management burden of the host CPU.

An ideal storage solution for many electronic devices, such as smartphones, tablet PCs, PDAs, eBook readers, MIDs, digital cameras and recorders, MP3, MP4 players, electronic learning products, digital TVs and set-top boxes. The low power and compact size makes it ideal in embedded applications, such as many Computer on Module (COM) designs.

Designed to JEDEC 4.5 specification
DDR interface
Sleep mode for power saving
Partitioning
Hardware reset
Boot operation mode
Enhanced Write Protection
Discard CMD / Sanitize CMD
Secure erase, trim and bad block erase commands
Supports HPI (High Priority Interrupt) and background operation

Flash eMMC

eMMC (embedded Multi-Media-Card) are low-profile high-density non-volatile data storage devices designed specifically for end products which need reliable data storage with low processor overhead. Although originally intended for consumer devices and designed to operate with voltages as low as 1.7V, eMMC Flash memory devices are finding applications in industrial, scientific and medical devices, especially hand-held, battery-operated or space-constrained devices. The low processor overhead frees up MCU resources making eMMC Flash memory suitable for embedded computing applications.

Based on the MMC Interface (eMMC is a trademark of the MultiMediaCard Association) Embedded, non-volatile memory system, comprised of both flash memory and a flash memory controller: ECC (Error Checking and Correcting) and Wear-leveling
Simplifies the application interface design and qualification through reduction in time-to-market and support for future flash device offerings
Frees the host processor from low-level flash memory management
Small BGA package
Specifications are managed by JEDEC

产品技术参数
属性 数值
存储器大小 16 Gbyte
接口类型 EMMC
封装类型 BGA
引脚数目 153
安装类型 表面贴装
单元类型 NAND
长度 11.5mm
高度 1.2mm
宽度 13mm
尺寸 11.5 x 13 x 1.2mm
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